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Năng lực sản xuất

Năng lực sản xuất

Năng lực sản xuất

 

STT

Danh mục

Năng lực sản xuất

1

Layers

Từ 1-16

2

Material

FR-4, Insulated Metal Substrate, High frequency material etc.

3

Max. manufacturing size

500mm x 1200mm

4

Outline tolerance

±0,1mm

5

Board thickness range

0.20mm -  8.00mm

6

Board thickness tolerance (t≥1.0mm)

± 10%

7

Board thickness tolerance(t<1.0mm)

± 0.1mm

8

Core thickness

0.075mm--5.00mm

9

Min. trace width(HOZ base copper for outler layer )

0.075 mm

10

Min. trace space(HOZ base copper for outler layer )

0.075 mm

11

Min. trace width(1OZ base copper for outler layer )

0.125 mm

12

Min. trace space(1OZ base copper for outler layer )

0.125 mm

13

Min. trace width(2OZ base copper for outler layer )

0.18 mm

14

Min. trace space(2OZ base copper for outler layer )

0.18 mm

15

Min. trace width(3OZ base copper for outler layer )

0.23 mm

16

Min. trace space(3OZ base copper for outler layer )

0.23 mm

17

Copper thickness for outer layers

35um--175um

18

Copper thickness for inner layers

17um--175um

19

Drilling holes size

0.10mm--6.35mm

20

Finish holes size

0.10mm--6.30mm

21

Hole size tolerance

±0.05mm

22

Hole position tolerance

±0.075mm

23

Aspect ratio

12:1(drill hole>0.30MM) , 8:1(drill hole≤0.30MM)

24

Solder mask type


Liquid photoimageable solder resist ink

 

25

Solder mask color

White, black, blue, green, yellow, red etc.

26

Min. solder mask bridge


0.125mm(black),other 0.10mm

 

27

Min. solder mask clearance ring

0.05mm

28

Plug holes range

0.25mm--0.65mm

29

Impedance tolerance

± 10%

30

Au & Ni thickness for Immersion gold thickness Au thickness:

2~4U",Ni thickness: 120~200U

31

Au & Ni thickness for gold fingers

Au thickness: 5~30U",Ni thickness: 120~200U120~200U

32

Copper in hole wall

20 ~25UM

33

Surface finish type

Hasl/Lead free Hasl, Immersion gold, Immersion Tin, Immersion silver, OSP, etc

 


 

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